1. 2. 3. material content data sheet sales product name tle42764dv issued 28. august 2013 ma# MA000723204 package pg-to252-5-11 weight* 365.94 mg construction element material group substances cas# if applicable weight [mg] average mass [%] sum [%] average mass [ppm] sum [ppm] chip inorganic material silicon 7440-21-3 3.179 0.87 0.87 8687 8687 leadframe non noble metal iron 7439-89-6 0.205 0.06 559 inorganic material phosphorus 7723-14-0 0.061 0.02 168 non noble metal copper 7440-50-8 204.243 55.81 55.89 558128 558855 wire non noble metal aluminium 7429-90-5 0.179 0.05 0.05 488 488 encapsulation organic material carbon black 1333-86-4 0.296 0.08 810 plastics epoxy resin - 13.631 3.72 37248 inorganic material silicondioxide 60676-86-0 134.233 36.68 40.48 366816 404874 leadfinish non noble metal tin 7440-31-5 5.072 1.39 1.39 13861 13861 plating non noble metal nickel 7440-02-0 0.076 0.02 208 inorganic material phosphorus 7723-14-0 0.000 0.00 0.02 1 209 solder noble metal silver 7440-22-4 0.119 0.03 326 non noble metal tin 7440-31-5 0.095 0.03 261 non noble metal lead 7439-92-1 4.552 1.24 1.30 12439 13026 *deviation < 10% sum in total: 100,00 1000000 important remarks: infineon technologies ag provides full material declaration based on information provided by third parties and has taken and continues to take reasonable steps to provide representative and accurate information. infineon technologies ag and infineon technologies ag suppliers consider certain information to be proprietary, and thus cas numbers and other limited information may not be available for release. all statements are based on our present knowledge, are provided 'as is' and may be subject to change at any time due to technical requirements and development without notification. company infineon technologies ag address 81726 mnchen internet www.infineon.com
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